Semi Surface S 3 Shim Spinning Systems

Semi Surface S 3 Shim Spinning Systems

Semi Surface S 3 Shim Spinning Systems

Semi Surface S 3 Shim Spinning Systems

Semi Surface S 3 Shim Spinning Systems

Semi Surface has developed a wide variety of wafer polishing templates, carriers, CMP holders, pad conditioner tools, and various associated accessories. A key element to the patented Semi Surface designs is its S 3 Shim Spinning System. This major advancement in wafer polishing technology allows for the wafer to spin or rotate inside the template cavity or pocket during polishing. This dynamic feature provides for even and consistent polishing across the entire surface of the wafer. Other major advantages of the system are outlined in the “Semi Surface Advantage” section.

The wafer rotation, or spinning effect, is achieved using two pieces, called the “SHIM” and the “INSERT”. The Shim is placed at the bottom of the template cavity, and the black napcon Insert is placed on top of the Shim. The wafer is then placed on top of the napcon Insert, and adheres to the Insert through water suction (this is a clean wet process). The Insert/Shim combination then spins within the template/carrier cavity during polishing, while remaining firmly seated in the cavity at start-up, and throughout the polishing run. The Semi Surface S 3 system allows for rotation or spinning to occur at 3 different levels; the polishing table/platen, the polishing head, and the wafer within the template cavity. The relief of pressure against the cavity walls through the spinning process avoids wafer blowouts, drops, and eliminates damage to the wafer, the cavity wall, template, and the polishing pad.

 

The Shims are provided in a variety of sizes and thicknesses, to accommodate all wafer diameters, material thicknesses, and polishing removal requirements. The different shim thicknesses allow for a broader range of material thickness to be polished with the same template, thus reducing the need for many templates with different cavity depths. This is accomplished by simply using a different thickness of Shim to adjust the cavity depth for a different thickness of material. Please see the Illustrations provided to further describe the unique and effective features of then Semi Surface S 3 Shim Spinning System.

Design by: Toàn Cầu