A PadPocket Template is a special case and is only used for Platen Templates or Gear Templates for a wafer where the product rests in the pocket and the upper side is polished. This restriction is driven by the fact that the PadPocket Template has no poromeric material and therefore, no water adhesion to retain the wafer.
The major advantage to the PadPocket Template is that lacking the poromeric material, there is virtually no compression and no shim adjustments for the compression. The wafer spins on the polishing pad that acts as the bottom of the wafer pocket and will allow the wafer to spin for extended periods of time under heavy pressure.
This polishing pad will provide some minor buffing of the backside of the wafer but this will be minor as there is no exposure to slurry on the backside. Further, the polishing pad will also buff the PET at the bottom of the wafer pocket which will further benefit the continued rotation of the wafer and polishing pad under heavy usage.
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